silicon nitride bonded silicon carbide plate

Physical items

Value

Apparent porosity %

≤18

Bulk density g/cm3

≥2.60

Cold compression strength Mpa

≥140

Modulus rapture at room temperature 1400°C Mpa

≥40

Modulus rapture at elevated temperature 1400°C Mpa

≥40

Coefficient of thermal liner expansion x 10-6/°C 1100°C

≤4.18

Thermal Conductivity w/(m·k) 350°C

≥16

Refractoriness °C

1800

0.2Mpa loading softening point °C

1600

Max working temperature °C

1550

Composition %

SiC  ≥70

Si3N4  ≥20

Fe2O3  ≤0.7

SiC + Si3N4  ≥90

Si  ≤0.5